Silver Conductor Paste For Aluminum Substrate

DT3003X is a mesotherrnal sintered conductor paste, designed for aluminum substrate based thick film circuit and microcrystalline glass substrate based thick film electrical heating element. non-toxic element conform to European RoHS environmental regulation (2002/95/EC). It has features of strong adhesive force, good weldability, excellent ageing resistance, and good conductivity.

Place of Origin Hunan, China (Mainland)
Brand Name LEED-INK
Model Number DT3003X
Type Insulation Film
Viscosity 70±25Pa.S(10 rpm , 25°C±0.5°C, 1 min)
Fineness <10µm
Solid Content 82±2%
Screen Mesh 250~300 stainless stell screen
Leveling Time at room temperature, 2~3min
Drying 120~150°C/(>15 min)
Firing 550°C/(>10min)
Film Thickness (µm) 14±2 µm
Advantage 1 Strong Adhesive Force
Advantage 2 Good Conductivity and Weldability
Silver Conductor Paste For Aluminum Substrate