Silver Conductor Paste For Aluminum Substrate (DT30032)

Silver Conductor Paste For Aluminum Substrate

(DT30032)


DT3003X is a mesotherrnal sintered conductor paste, designed for aluminum substrate based thick film circuit and microcrystalline glass substrate based thick film electrical heating element. non-toxic element conform to European RoHS environmental regulation (2002/95/EC). It has features of strong adhesive force, good weldability, excellent ageing resistance, and good conductivity.

Place of Origin Hunan, China (Mainland)
Brand Name LEED-INK
Model Number DT30032
Type Insulation Film
Silver Content(%) 75
Viscosity 70±25Pa.S(10rpm,25°C±0.5°C,1min)
Fineness <10µm
Solid Content 82±2%
Screen Mesh 250~300 stainless steel screen
Leveling Time at room temperature, 2~3min
Drying 120~150°C/(>15min)
Firing 550°C/(>10min)
Film Thickness (µm) 14±2µm
Conductivity (mO/sq) =3
Silver Conductor Paste For Aluminum Substrate (DT30032)